US-based semiconductor firm Texas Instruments (TI) is planning to start construction on its new semiconductor wafer fabrication plants (fabs) in Sherman, Texas in US, in 2022.

The firm plans to build a total of four production facilities at a site in North Texas, which are estimated to cost around $30bn. The facilities are expected to support 3,000 jobs.

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TI chairman, president and CEO Rich Templeton said: “TI’s future analog and embedded processing 300-mm fabs at the Sherman site are part of our long-term capacity planning to continue to strengthen our manufacturing and technology competitive advantage and support our customers’ demand in the coming decades.

“Our commitment to North Texas spans more than 90 years, and this decision is a testament to our strong partnership and investment in the Sherman community.”

The new 300mm semiconductor wafer fabrication plants are aimed at helping meet the anticipated demand surge for semiconductor in electronics, over time.

TI plans to start construction on the first and second fabs in 2022, with production from the first new fab planned to commence as early as 2025.

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The firm expects the new fabs to complement its existing 300mm fabs- DMOS6 in Dallas, Texas; RFAB1 and the soon-to-be-completed RFAB2 in Richardson, Texas; and LFAB in Lehi Utah.

LFAB, which was recently acquired by the firm, is due to start production in early 2023.

Texas Instruments is engaged in designing, manufacturing, testing and selling analog and embedded processing chips.

These chips are used in industrial, automotive, personal electronics, communications equipment and enterprise systems.

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Design concept for Texas Instruments’ new 300mm semiconductor wafer fabs in Sherman. Credit: Texas Instruments Incorporated/PRNewswire.